2D MPM Speedline Accela Screen Printer
The MPM Accela printer from Speedline is the ultimate printing solution for manufacturers of high-volume,
high-technology applications. Accela processes the largest, thinnest or most complex substrates with
unprecedented speed, accuracy and ease. Its leading edge design incorporates the best features of our
proven platforms and includes 11 patents and patent-pending innovations. An industry break-through,
parallel processing, allows critical operations to occur simultaneously, not serially, resulting in unmatched
raw throughput. But Accela doesn’t stop there. Other advantages include:
**Zanite™ material provides Solid foundation for Superior Accuracy and Repeatability
**Advanced consumables management for fast setup and changeover
**Proven reliability
**Outstanding flexibility and ease of use
**Advanced High-speed, Post-print Inspection
* Sku # 16518: For pricing or questions please call, email us
ENHANCED 2D VISION additional details below and photos above:
• Vision: Speed Vision (Contrast),
• Speed vision (Texture), Paste Transfer,
• Stencil Vision, Stencil Blockage
• Ring Light
• Vision Field-of-View (FOV) 10.6 mm x 8.0 mm (0.417" x 0.315")
• Fiducial Types Standard shape fiducials, pad/aperture
• Camera System — patented look up/down vision
MPM Vision System & Inspection:

MPM’s patented printer-based Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It’s flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and
compares it with the required coverage. 2D Inspection is integrated directly into the stencil printer to provide an immediate source of data.
BridgeVision and StencilVision

BridgeVision is a patented method of analyzing bridge defects on circuit boards in the post-print inspection process. This innovative system utilizes texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects. StencilVision utilizes texture-based technology to check the underside of a stencil for solder paste contamination. Wiper operation can be driven by the results obtained.
Features:
• Paste Dispenser
• Maximum Substrate Weight 7 kg (15 lb) / handles the largest, thinnest &/or most complex substrates
• Windows 7 O/S
• Benchmark Software
• SPC Data Collection
• Closed-Loop Squeegee Head
• CANopen Control System
• Adjustable Stencil Shelf
• Vacuum Wiper* with Solvent
• Flat-Panel Display
• Three Stage Transport Rail System• Power Requirements 230V AC (±10%) single phase @ 50/60Hz
• Machine Weight 2205 kg (4850 lb)
PERFORMANCE
• Total System Alignment ±12.5 microns
• Accuracy and Repeatability (±0.0005") at 6 sigma, Cpk of greater than or equal to 2.0*
• Wet Print Deposit ±25 microns
• Accuracy and Repeatability (±0.001") at 6 sigma, Cpk of greater than or equal to 2.0*
• Cycle Time Less than 5.5 sec
Specifications
BOARD HANDLING
• Maximum Board Size (X x Y) 558 mm x 508 mm (22” x 20”)
• Minimum Board Size (Y x X) 50.8 mm x 50.8 mm (2” x 2”)
• Maximum Substrate Weight 7 kg (15 lb)
• Board Edge Clearance Configurable to 3 mm (0.120") or 5 mm (0.200")
• Transport Speed 8 mm/sec to 1270 mm/sec (0.3"/sec to 50"/sec)
• Transport Height From Floor 813 mm to 1041 mm (32" to 41")
• Transport Track Feed Direction Left-Right, Right-Left, Right-Right, Left-Left
PRINT PARAMETERS
• Maximum Print Area (X x Y) 558 mm x 508 mm (22" x 20")
• Snap-off -0.025 mm to 12.7 mm (-0.001" to 0.500")
• Print Speed 6 mm/sec to 305 mm/ sec (0.25"/sec to 12"/sec)
• Print Force 0.4 kg to 22 kg (0.9 lb to 50 lb)
• Print Stroke ±280 mm (±11") from center
• Stencil Frame Size 737 mm x 737 mm (29" x 29") adjustable to 584mm x 584 mm, (23" x 23") for tubular frames