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SKU 16529: For pricing or questions please call or email us
• Excellent 3D inspection
• Dongle Active/Available
• Machine working when taken off-line
• Fastest solder paste inspection (SPI) system
• 3D SPI system for mid- to high-volume manufacturing• Great inspection ability of lead-free manufacturing process and fine-pitch/01005 components• 14 micrometers resolution• Inspection Speed up to 171cm2/s @14µm• 87cm2/sec at 10 micrometers resolution• Warp Auto-Tracking system, provides outstanding defect-detecting ability• Camera is capable of 200 frames per second• 100 frames for each side respectively• Processes images using dual phase-shifted fringe patterns that eliminates shadows and provides the best possible defect detection• Phase-shifted fringe pattern to measure height profiles of solder paste deposited upon a circuit board prior to placement• Strobe illuminator provides short timed exposures• Eliminates shadowing that creates a similar affect as two cameras• Create inspection programs quickly and easily• PC system calculates the statistical data and provides statistical reports• Scan Width 23.2mm• Maximum Inspection Area 20 x 18 inches (510 x 460 mm)• Scan Time (254x148 sq.mm) 8.7s• Scan Time (330x250 sq.mm) 16.0s• Shadow Free Inspection• Smallest solder capable 01005