2022 Nordson YESTECH FX-940 Series 3D AOI Inspection delivers unmatched PCB inspection with advanced megapixel cameras, 3D imaging, and rapid setup in under 30 minutes. With high accuracy, low false failure rates, and versatile use across all line positions, this machine is designed to elevate quality and efficiency—an essential investment for boosting production output.

SKU 10157 : For pricing or questions please call or email us

• Year 2022 , Mint Condition
• Automated Optical Inspection Systems with Nordson YESTECH NYT Vision Software
• Automated In-line AOI System
• Digital Fringe Projection 3D Inspection
• Nordson YESTECH's Vision Software is a powerful image-processing engine:
• Advanced Proprietary Fusion Lighting Multiangle LED
• 9 megapixel image processing technology integrates several techniques:
• Color Inspection - Normalized Correlation - Rule-Based Algorithms
• Provides COMPLETE Inspection Coverage With an EXTREMELY Low False Failure Rate
• FX-940 is Configurable for all line positions
• Bi-directional conveyor
• 4 Levelers
• Camera:
• 1 Top Down Viewing Camera
• 4 Side Viewing Cameras, used to inspect solder joints and verify correct part assembly
• Board Clamp
• High-Speed PCB Assemblies 3D Inspection
• Greatly Improves Quality & Increases Throughput
• Capture On-The-Fly Technology
• Quick Set-Up - Fast & Intuitive Programming
• Standard Package Library Simplifies Training & Ensures Program Portability Across Manufacturing Lines
• Exceptional defect coverage
• Inspect Solder Joints
• Verify Correct Part Assembly
• Correct part / polarity
• Through-hole parts
• Co-planarity of chips, BGAs & other height sensitive devices
• Exceptional AOI for:
• Paste
• Pre / Post-Reflow
• Final Assembly Inspection
• Off-Line Programming:
• Rework, Review and Program Creation
• Maximizes Machine Utilization
• Real-Time SPC Monitoring
• Inspection Area: 508x533mm (20x21in)
• Motion System Type: Closed-loop Servo Motors
• X-Y Velocity: 1000 mm/s (39.4 in/s) maximum
• X-Y Acceleration: 1g peak with S-curves
• X-Y Repeatability: ±0.025 mm (0.001 in.), 3 sigma
• X-Y Resolution: 0.010 mm (0.0004 in.), 3 sigma
• Positional Accuracy: ±0.075 mm (0.003 in.), 3 sigma
• Computer: Windows Based Computer with Multi Core processor
• Tilt Angle:
• Left 27°
• Right 27°
• Forward 34°
• Backward 28°
• Throughput: Up to 30 sq. in./sec. > 1.5 million components per hour
• Maximum Board Size: 20” x 21” (500mm x 525mm)
• Clearance: 2” (50mm) top and bottom
• False Calls: <500 PPM (<0.05% typical)
• Defects Detected: Part: position, missing, wrong, polarity, skew, tombstone
• Lead: bent, lifted, bridging
• Solder: open, insufficient, short, solder balls
• Software:
• Algorithms: Color, OCV, OCR, barcode recognition, both image and rule-based algorithms, with Optional 3D
• Data Requirements: ASCII Text, X-Y position, part #, ref. #, polarity
• CAD Translation Package: Aegis, Unicam, Fabmaster, YESTECH CAD Utility
• Programming Skill Level: Technician or operator
• Operating System: Windows 10
• Data Outputs: Text, SQL, ODBC, MS Access
• Hardware
• Material Handling: SMEMA, dual direction auto width conveyor, pass / fail signals, board clamping