Test Research Inc. (TRI) designs, manufactures and markets precision test equipment for the world’s leading electronics manufacturing service (EMS) companies.

Dynamic imaging offers an improved solution for 3D SPI in term of accuracy, speed and field of view (FOV). The main advantage of dynamic imaging is that inspection is performed fast because the inspection system continuously scans therefore there is no need to stop and go during the inspection process

TRI TR7007 3D Solder Paste Inspection Technology, SPI

SKU 16529: For pricing or questions please call or email us

• Excellent 3D inspection
• Dongle Active/Available
• Machine working when taken off-line
• Fastest solder paste inspection (SPI) system
• 3D SPI system for mid- to high-volume manufacturing
• Great inspection ability of lead-free manufacturing process and fine-pitch/01005 components
• 14 micrometers resolution
• Inspection Speed up to 171cm2/s @14µm
• 87cm2/sec at 10 micrometers resolution
• Warp Auto-Tracking system, provides outstanding defect-detecting ability
• Camera is capable of 200 frames per second
• 100 frames for each side respectively
• Processes images using dual phase-shifted fringe patterns that eliminates shadows and provides the best possible defect detection
• Phase-shifted fringe pattern to measure height profiles of solder paste deposited upon a circuit board prior to placement
• Strobe illuminator provides short timed exposures
• Eliminates shadowing that creates a similar affect as two cameras
• Create inspection programs quickly and easily
• PC system calculates the statistical data and provides statistical reports
• Scan Width 23.2mm
• Maximum Inspection Area 20 x 18 inches (510 x 460 mm)
• Scan Time (254x148 sq.mm) 8.7s
• Scan Time (330x250 sq.mm) 16.0s
• Shadow Free Inspection
• Smallest solder capable 01005