SMT Inspection
Test Research TRI TR7007 3D Solder Paste Inspection Technology
2011
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SMT equipment
Three-dimensional optical and solder paste inspection for height, volume and coplanarity measurement.
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3D inspection measures true height and volume rather than inferring it from a 2D image, which reduces false calls on lifted leads, coplanarity and paste volume.
Tell us your board size and cycle-time target and we will confirm what is available or source a matching 3D system.